This product is manufactured using special composite materials and precision coating technology, enabling it to maintain stable adhesive performance within a broad temperature range of -10°C to 60°C, ensuring reliable packaging effects under various environmental conditions. The product features precisely controlled peel strength, preventing adhesive residue during automatic peeling and effectively avoiding contamination of precision components.

The product employs a multi-layer composite structure, with a surface layer that offers excellent abrasion and tear resistance, a middle functional layer that provides stable adhesive strength, and a bottom protective film that ensures cleanliness during transportation and storage. In practical applications, the top cover tape is perfectly compatible with various types of carrier tapes, including plastic ones such as PS, PET, and PC, as well as specialized paper-based carrier tapes.

This product is manufactured using high-strength composite materials, offering excellent dimensional stability and mechanical strength to ensure consistent shape and performance in high-speed automated production processes. The surface is specially treated to provide an appropriate friction coefficient and outstanding anti-static properties.

The design of the bottom cover tape fully meets the stringent demands of modern electronics manufacturing. Its precision positioning holes and standard dimensional specifications ensure perfect compatibility with various automated equipment. Its unique surface coating technology ensures reliable bonding with the top cover tape while allowing easy separation when needed, without causing any damage to the components.

The product is available in multiple specifications, meeting the packaging needs of components of various sizes—from 0201 miniature components to QFP large-scale integrated circuits.