Jiangsu Yongjia Electronic Materials Co., Ltd. has dedicated over 18 years to the R&D and manufacturing of specialized materials for the global electronics industry. Located in the industrial hub of Nantong, our 16,000-square-meter facility is the backbone of high-precision tape production.
As a premier Wholesale HIPS Material Manufacturer, we specialize in the core track of functional tapes. Our products—ranging from HIPS carrier tape components to high-temperature heat-seal cover tapes—are essential for the modern semiconductor and SMT supply chains.
HIPS (High Impact Polystyrene) is the gold standard for electronic carrier tapes due to its exceptional dimensional stability and impact resistance. As a leading manufacturer, we engineer HIPS to provide optimal ESD (Electrostatic Discharge) protection, ensuring that delicate chips are safe during transit.
The global shift toward miniaturized electronic components (01005 and 0201 sizes) has driven the demand for higher precision HIPS materials. Current trends emphasize ultra-smooth surfaces and consistent tensile strength to support high-speed SMT pick-and-place machines.
International buyers from Europe, North America, and Southeast Asia are increasingly seeking reliable HIPS Material Factories that can guarantee batch-to-batch consistency. The demand is surging in the EV automotive and 5G infrastructure sectors.
Providing robust HIPS packaging for sensor and ECU components in electric vehicles.
Ultra-clean HIPS carrier tapes for high-end CPU and memory chip packaging.
Cost-effective packaging solutions for consumer electronics and smart home devices.
Supporting industrial stamping processes with high-tensile glass fiber and PET tapes.
As the "Wholesale HIPS Material Manufacturer" of choice, we are investing in eco-friendly HIPS variants that offer easier recyclability without losing their protective properties. Our commitment to sustainability is part of our "people-oriented" core principle, viewing our technological talent as our primary resource for future growth.
Precision-engineered for heat-activated bonding on HIPS and PC carrier tapes.
Designed for room-temperature sealing with stable peel strength.
Flame-retardant electrical insulation with excellent conformability.
Against the backdrop of global market growth, capacity optimization remains key for cover tape development.
Miniaturization of electronic components is driving the next wave of customized packaging materials.
How high-end heat-sealing tapes are accelerating the domestic substitution process in China.
YONGJIA Electronic
