Premium Selection of Functional TapesEstablished in June 2007, Jiangsu Yongjia Electronic Materials Co., Ltd. has dedicated over 18 years to the innovation and manufacturing of advanced functional tapes. Our 16,000 square meter facility in Nantong serves as a hub for R&D, high-capacity production, and global distribution. We specialize in the development of double sided splicing tapes, heat-seal cover tapes, and specialized adhesive solutions that drive the semiconductor and electronics manufacturing industries forward.
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The global demand for Double Sided Splicing Tape is witnessing unprecedented growth, primarily driven by the acceleration of Industry 4.0 and the miniaturization of electronic components. As a leading manufacturer, we understand that splicing tape is not just a secondary material; it is a critical component in ensuring continuous production flow in Surface Mount Technology (SMT) lines.
Modern industrial trends favor high-efficiency automation. In the semiconductor sector, "zero downtime" is the gold standard. High-quality splicing tapes allow for the seamless connection of carrier tapes and cover tapes, preventing feeder jams and machine stops. Globally, procurement departments are shifting their focus from simple price-per-roll metrics to "Total Cost of Ownership," prioritizing tapes with superior adhesive stability, ESD (Electrostatic Discharge) safety, and thermal resistance.
Enterprises in North America, Europe, and SE Asia are increasingly seeking suppliers who can provide customized widths and thicknesses. Reliability in bonding across different substrate materials like PET, Paper, and Polystyrene is a top priority for global buyers.
The shift toward lead-free soldering and high-temperature reflow processes necessitates tapes that can withstand extreme heat without leaving residue or losing adhesion. Our R&D team focuses on silicon-free and low-outgassing adhesive formulations.
Environmentally friendly adhesives and recyclable liners are becoming standard requirements. As a responsible Chinese manufacturer, we align our production with RoHS and REACH standards to meet international environmental regulations.
Our Double Sided Splicing Tapes and functional tapes find applications in diverse high-tech sectors:
Used for the secure packaging of automotive-grade chips and sensors. Our tapes ensure that components remain protected during the rigorous vibrations and thermal cycles of automotive assembly.
Utilizing our Acetate Cloth Tape and PET tapes for internal insulation in transformers and motors. These materials provide excellent dielectric strength and flame retardancy.
High-end heat-sealing tapes and splicing solutions assist in the upgrade of semiconductor packaging, ensuring precise component placement and reliable bonding of carrier tapes.
Used in the stamping industry to hold delicate parts or as a protective layer during the manufacturing of metal frames for electronic devices.
As a prominent Chinese factory, we offer a unique blend of "Quality, Scale, and Innovation." Our production workshop is designed for high-volume output while maintaining the stringent quality control necessary for the electronics industry.
Our in-house lab tests for peel strength, aging resistance, and ESD properties, ensuring every batch meets the high standards expected by our global partners.
From coating and laminating to precision slitting, our integrated production process allows for rapid customization and shorter lead times compared to middle-man suppliers.
Our commitment to excellence is backed by rigorous certifications, ensuring that our heat-seal cover tapes and splicing tapes are safe for the most sensitive electronic components.
Jiangsu Yongjia consistently adheres to the core principle of "people-oriented," regarding talent as the primary resource for enterprise development. Against the backdrop of steady growth in the global cover tape market, capacity optimization and technological advancement have become core competencies. Our self-adhesive cap tapes and high-end heat-sealing tapes are specifically designed to meet the diverse packaging needs of the miniaturized component era.
The acceleration of domestic substitution in the semiconductor industry has positioned us as a key player in helping global companies upgrade their packaging materials. By providing reliable splicing solutions, we enable our clients to achieve higher yield rates and more efficient manufacturing processes.
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